Gurgaon-based fintech startup Loan Frame Technologies Pte Ltd has raised $2.25 million (Rs 15.3 crore) in seed investment led by Vedanta Capital, a top company executive told Techcircle.
Other investors who participated in the round include William Campbell, former chairman of Chase Card Services, and Toos N Daruvala, co-CEO of MIO Partners, Inc., McKinsey Investment Office.